Journal Articles

·     Dündar, H., Ayhan, A.O. "Three-dimensional fracture and fatigue crack propagation analysis in structures with multiple cracks", Computers and Structures, Vol 158, pp.259 - 273, ISSN: , DOI: 10.1016/j.compstruc.2015.06.012, (Link).

·     Uslu, M., Demir, O., Ayhan, A.O. "Surface Cracks in Finite Thickness Plates under Thermal and Displacement-Controlled Loads – Part 1: Stress Intensity Factors" ,Engıneering Fracture Mechanics ,Vol. ,pp. 284 - 295 ,ISSN: ,DOI: dx.doi.org/10.1016/j.engfracmech.2013.11.012 , ,2014 ,(Link).

· Uslu, M., Demir, O., Ayhan, A.O. "Surface Cracks in Finite Thickness Plates under Thermal and Displacement-Controlled Loads – Part 2: Crack Propagation" ,Engineering Fracture Mechanics ,Vol. ,pp. 255 - 269 ,ISSN: ,DOI: dx.doi.org/10.1016/j.engfracmech.2013.11.008 , ,2014 , (Link).

· Sulu, İ. Y., Ayhan, A. O., “Sensitivities of two-dimensional fracture problems to the near-tip mesh parameters,” International Journal of Fracture, Letters in Fracture and Micromechanics, 2012 , (Link).

· Ayhan, A. O., Yucel, U. "Stress intensity factor equations for mixed-mode surface and corner cracks in finite-thickness plates subjected to tension loads" ,International Journal of Pressure Vessels and Piping ,Vol. 88 ,pp. 181 - 188 ,ISSN: ,DOI: 10.1016/j.ijpvp.2011.05.009 , ,2011 , (Link)

·    Ayhan, A. O., “Simulation of Three-Dimensional Fatigue Crack Propagation Using Enriched Finite Elements,” accepted for publication in Computers and Structures, 2011 (Link).

· Nart, E. and Ayhan, A. O., “Crack Insertion, Meshing and Fracture Analysis of Structures Using Tetrahedral Finite Elements,” accepted for publication in European Journalof Mechanics – A/Solids, 2011 (Link).

·    Ayhan, A. O., “Three-Dimensional MixedMode Stress Intensity Factors for Cracks in Functionally Graded Materials Using Enriched Finite Elements,” InternationalJournal of Solids and Structures, Vol. 46, n3-4, 796-810, 2009 (Link). 

·  Ayhan, A. O., “Stress Intensity Factors for Three-Dimensional Cracks in Functionally Graded Materials Using Enriched Finite Elements,” International Journal of Solidsand Structures, Vol. 44, n25-26, pp. 8579-8599, 2007 (Link).

· Ayhan, A. O., “Mixed Mode Stress Intensity Factors for Deflected and Inclined Corner Cracks in Finite-Thickness Plates,” International Journal of Fatigue, Vol. 29, pp. 305-317, 2007 (Link).

· Ayhan, A. O., Kaya, A. C. and Nied, H. F., “Analysis of Three-Dimensional Interface Cracks Using Enriched Finite Elements,” International Journal of Fracture, Vol. 142, pp. 255-276, 2006 (Link).

· Ayhan, A. O., “Mixed Mode Stress Intensity Factors for Deflected and Inclined Surface Cracks in Finite-Thickness Plates, ”Engineering Fracture Mechanics, Vol. 71, 7-8, pp. 1079-1099, May 2004 (Link).

· Ayhan, A. O. and Nied, H. F., “Stress Intensity Factors for Three-Dimensional Surface Cracks Using Enriched Finite Elements,” International Journal of Numerical Methods in Engineering, Vol. 54, pp. 899-921, 2002 (Link).

· Ayhan, A. O. and Nied, H. F., “Finite Element Analysis of Interface Cracking in Semiconductor Packages,” IEEE Transactions on Components and Packaging Technologies, Vol. 22, n4, pp.503-511, December 1999 (Link). 

 

Conference Proceedings

·     Demir, O., İriç, S., Ayhan, A.O., Lekesiz, H, “Investigation of mixed mode-I/II fracture problems - Part 1: computational and experimental analyses”, 5th International Conference on "Crack Paths", Ferrara, Italy, September 16-18, 2015 

·     Demir, O., Ayhan, A.O., “Investigation of mixed mode-I/II fracture problems - Part 2: evaluation and development of mixed mode-I/II fracture criteria”, 5th International Conference on "Crack Paths", Ferrara, Italy, September 16-18, 2015 

·     Bozkurt, M., Ayhan, A.O., Yaren, M.F., İriç, S., “Finite element modeling and experimental studies on mixed mode-I/III fracture specimens”, 5th International Conference on "Crack Paths", Ferrara, Italy, September 16-18, 2015 

·     Dündar, H., Ayhan, A. O., “Multiple and non-planar crack propagation analyses in thin structures using FCPAS”, 5th International Conference on "Crack Paths", Ferrara, Italy, September 16-18, 2015 

·     Dündar, H., Ayhan, A. O., “Finite Element Modeling of Growing Multiple Three-Dimensional Cracks Under Cyclic Loads”, 10th International Fracture Conference, Kayseri, Turkey, April 24-25, 2014

·     Derya, M., Ayhan, A. O., “Numerical Simulation of Three-Dimensional Mode-I Crack Propagation Using FCPAS: First Set of Practical Case Studies”, 10th International Fracture Conference, Kayseri, Turkey, April 24-25, 2014

·     Demir, O., Dündar, H., İriç, S., Ayhan, A. O., “Three-Dimensional Fracture Analyses of Compact Tension Shear Specimen Under In-Plane Shear Mode Loading”, 10th International Fracture Conference, Kayseri, Turkey, April 24-25, 2014

·     Demir, O., Nart, E., Kurtiş, C., Ayhan, A. O., “Case Studies on Mode-I Fatigue Crack Propagation Using Fully Unstructured Finite Elements”, 10th International Fracture Conference, Kayseri, Turkey, April 24-25, 2014

·     Derya, M., Dündar, H. and Ayhan, A.O., “Three-Dimensional Fracture Analyses of UIC 60 Rail Failures,” 1st International Symposium on Innovative Technologies in Engineering and Science, Sakarya University, Sakarya, June 7-9, 2013.

· Ayhan, A. O., Nart, E., Kurtiş, C. and Uslu, M.,"Modeling of Three-Dimensional Fracture Problems Using FCPAS: Application On a Surface Crack Problem," Submitted to IMSP 2010, Denizli, Turkey, 13-15 October 2010.

· Sülü, İ. And Ayhan, A.O. ,"Mesh Sensitivity Studies for Two-Dimensonal Mixed Mode Fracture Problems Using Displacement Correlation Technique," Submitted to IMSP 2010, Denizli, Turkey, 13-15 October 2010.

· Nart, E. and Ayhan, A.O.,"Modeling and Analysis of Three-Dimensional Cracks Using Unstructured Finite Elements,", Abstract in ACE-X 2010, Paris, FRANCE, 8-9 July, 2010.

· Ozkan, U., Kaya, A. C., Loghin, A., Ayhan, A. O. and Nied, H.F., “Fracture Analysis of Cracks in Anisotropic Materials Using ANSYS^® and 3DFAS,” Proceedings of IMECE 2006, IMECE2006-15539, Chicago, IL, November 5-10, 2006.

· Ayhan, A. O., Kaya, A. C., Loghin, A., Laflen, J., McClain, R. D and Slavik, D., “Fracture Analysis of Cracks in Orthotropic Materials Using ANSYS^®,” Turbo Expo-2006 Proceedings on CD, GT2006-90599, Barcelona, Spain, ASME, 2006.

· Anresen, P.L., Ayhan, A., Catlin, G.M. and Catlin, W.R., "Development and Use of A Lee James Surface Cracked Specimen for Evaluating Chemistry and Flow Rate Effects in Realistic Cracks",Proceedings of Corrosion/04, NACE, Paper No: 04567, (2004).

· Ayhan, A. O. and Nied, H. F., “Nonlinear Deformation and Crack Interactions in Semiconductor Packages,” Damage and Fracture Mechanics VII, Editors: C. A. Brebbia and S. I. Nishida, pp. 113-122, October 2002.

· Ayhan, A. O. and Nied, H. F., “Analysis of Three-Dimensional Interface Cracking in Electronic Packages,” Advances in Fracture Research, Proceedings of ICF10, Editors: K. Ravi-Chandar, B. L. Karihaloo, T. Kishi, R. O. Ritchie, A. T. Yokobori Jr., T. Yokobori, ICF100832OR, Elsevier Science CD-ROM, ISBN 0080440428, December 2001.

· Ayhan, A. O. and Nied, H. F., “Analysis of the Evolution of Residual Stresses during Fabrication of a Flip-Chip Package,” TECHCON2000, pp.205, September 21-23, 2000, Phoenix, AZ.

· Ayhan, A. O. and Nied, H. F., “Finite Element Modeling of Crack Interactions with Solder Balls,” Proceedings of SEM IX International Congress on Experimental Mechanics, pp. 889-894, June 5-8, 2000, Orlando, FL.

· Pearson, R. A., Ayhan, A. O. and Nied, H. F., “Modeling the Mechanical Behavior of Underfill Resins and Predicting Their Performance in Flip-Chip Assemblies,” International Symposium on Advanced Packaging Materials, March 2000, pp. 63-67, Braselton, GA.

· Ayhan, A. O., Nied, H. F. and Pearson, R. A., “Three-Dimensional Interface Fracture Models for Semiconductor Packages,” TECHCON'98, pp.88, September 9-11, 1998, Las Vegas, NV.

· Ayhan, A. O. and Nied, H. F., “Finite Element Modeling of Interface Fracture in Semiconductor Packages: Issues and Applications”, ITHERM'98, 1998 InterSociety Conference on Thermal Phenomena, pp.185-192.

· Ayhan, A. O. and Nied, H. F., “Finite Element Analysis of Semiconductor Package Debonding due to Thermal Cycling,” MAMKON-97, International Conference on Problems in Mechanical Engineering, Istanbul Technical University, pp.373-378, June 4-6,1997, Istanbul, Turkey.

· Ayhan, A. O. and Nied, H. F., “Application of Finite Elements for Modeling Semiconductor Package Debonding due to Thermal Cycling,” TECHCON-96, pp.247, September 12-14, 1996, Phoenix, AZ.

 

Technical Reports

· Ayhan, A. O., Kaya, A. C., Laflen, J., McClain, R. D and Slavik, D., “Fracture Analysis of Cracks in Orthotropic Materials Using ANSYS^®,” GE Global Research Center Technical Publication, 2003GRC370, December 2003.

· Ayhan, A. O. and Nied, H. F., “Finite Element Stress Analysis of U-Bolt Hanger Supports,” Energy Research Center Technical Report, Lehigh University, January 2000.

· Ayhan, A. O. and Nied, H. F., “Finite Element Analysis of Socket Weld,” Energy Research Center Technical Report, Lehigh University, January 2000.

· Ayhan, A. O. and Nied, H. F., “FRAC3D-Finite Element Based Software for 3-D and Generalized Plane Strain Fracture Analysis,” March 31, 1998, SRC Technical Report.

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